Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Project Neo is an intriguing new initiative from Adobe that could act as one of the first truly effective bridges between 2D apps and 3D design. We've written about Project Neo before. It was one of ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...

A new set-top box has been developed by Kirk Hsu based in Taiwan called the Edison 3D, which has been designed to convert a normal 2D TV into a 3D TV providing HD viewing in the comfort of your own ...