ASE Technology has transformed from a low-margin OSAT to a critical AI infrastructure provider, driving a 263% surge in its ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

Google has ordered 3 million TPUs from Intel, and Nvidia is actively testing Intel’s 18A process technology, as both ...

ASX is posting record ATM revenue and raising its LEAP outlook above $3.5B, as advanced packaging demand climbs with AI infrastructure.

ASE Technology Holding Co., Ltd. ASX is benefiting from a favorable semiconductor industry backdrop, driven by surging artificial intelligence (AI) adoption, growing high-performance computing (HPC) ...

Amkor (AMKR) as an AI supply-chain chokepoint: low 2.35x fwd revenue, strong growth, packaging margins, 2028–30 targets, ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

Use left and right arrow keys to seek audio. One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...