Electrostatic discharge (ESD) is caused by the discharge of an excess or deficiency of electrons on one surface with respect to another surface or to ground. When a static charge is present on an ...
Electrostatic discharge (ESD) protection is critical at advanced nodes to safeguard designs against effects intensified by shrinking transistor dimensions and oxide layer thicknesses. On the other ...
Electrostatic discharge (ESD) issues in integrated circuit (IC) chip designs have become more critical at advanced semiconductor process nodes, due to shrinking transistor dimensions and oxide layer ...
Advanced CMOS process technologies enable IC designers to deliver higher performing devices, but also increase the need for extra board-level ESD protection to ensure the reliability of the end ...
Electrostatic discharge (ESD) protection remains a critical facet in the design and fabrication of CMOS integrated circuits. With the continuing downscaling of device dimensions and the increasing ...
Fig 1. Comparison of a traditional ESD protection design methodology and the PicoGuard XS architecture shows how the latter can provide matched inductance. Fig 2. In a traditional ESD device, the ...
•ESD protectors with low dynamic resistance won’t necessarily protect circuits. •Most damage is caused within the first nanosecond of an ESD event. •The ESD protector should set as close as possible ...
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