Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
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Newly discovered metallic material with record thermal conductivity upends assumptions about heat transport limits
A UCLA-led, multi-institution research team has discovered a metallic material with the highest thermal conductivity measured among metals, challenging long-standing assumptions about the limits of ...
Figure 1. SimuReal simulation with heat mapping. Heat mapping is integrated into Coriolis Composites’ SimuReal software, correcting for IR camera incidence angle (IR camera seen at far top right) to ...
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