The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design ...

Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance ...

PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...

The Bull brand, regrouping Atos Group’s Advanced Computing and AI activities, was officially launched on January 29, 2026, bringing back a historically rooted technology name. Bull is a global leader ...

The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable ...

Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...

Within the increasing complexity of SoC design, bus-interconnect is a key component which has led to evolution in the design of interconnect with a new socket-based approach. The socket is defined as: ...

3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...