New Electronics

Keysight launches 3D interconnect design tool for advanced chiplet and 3DIC packages

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design ...
Electronics For You

Keysight’s 3D Interconnect Designer for Tackling Complexity in 3D Chiplet Designing

The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...
TMCnet

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity ...
EDN

Design the best interconnect for your next RF or microwave circuit

Microwave designers have long been aware of the importance of proper interconnect design as a critical step to successful circuit performance. As a matter of fact, one of the distinguishing features ...
EDN

Software accelerates 3D interconnect design

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...
DATAQUEST

Google’s high-speed interconnect architecture to push 800G+ optical transceiver share past 60% by 2026

Based on TrendForce’s projection that nearly 4 million Google TPUs will be shipped in 2026, demand for 800G-plus optical modules is expected to exceed 6 million units ...
Electronic Design

Overcome Challenges in Embedded Optical Interconnect Design

Optical transceivers are the key components that transform electrical signals to light over optical cables that are needed to build things like 5G infrastructure. The emergence of IoT in cloud ...
Design-Reuse

Making connections: The pursuit of chiplet interconnect standardization

It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected,” Gordon Moore wrote in his famous article, Cramming more ...
Semiconductor Engineering

Power Benefits Of Modular Interconnect Design Using Network-On-Chip Technology

A look at why interconnects based on modular network on chip (NoC) technology comsume less power than older bus- and crossbar-based interconnects. January 31st, 2013 - By: Various Writers The ...
Electronic Design

Don’t Do It: Design Your Own On-Chip Interconnect

It’s extremely difficult to create an interconnect for complex SoCs. Building an interconnect requires a huge budget and a lot of engineering talent. Purchasing interconnect IP gives a company a head ...
Electronics360

Smiths Interconnect to showcase next-generation test solutions at DesignCon 2026

Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...
Semiconductor Engineering

Power Benefits Of Modular Interconnect Design Using Network-On-Chip Technology

The system-on-chip (SoC) interconnect spans the entire floorplan of a chip and consumes a significant portion of the power. The interconnects of today’s SoCs are a distributed architecture of switches ...