Validating design kits requires investment and collaboration across the supply chain, but it pays off in fewer layout respins and lower risk.

A new technical paper titled “Modeling and Optimizing Performance Bottlenecks for Neuromorphic Accelerators” was published by ...

Designing resilient chips with SLM can help combat aging effects, security threats, and get to market faster with higher ...

Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

A new technical paper titled “Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond” was published by researchers at ...

One of Jim’s strongest convictions is how open ecosystems like RISC-V and Atlas are what create real progress. In his words, ...

Nevertheless, the economic incentive is growing. Interposers are becoming bigger, more essential, and more costly for many ...

To address these challenges head-on, Siemens EDA offers the Calibre IP Checker, part of the Calibre Pattern Matching tool ...

The application of AI into design tools and flows will take several forms, each independent, but all potentially working together.

A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal ...

Current Degradation in Ultra-Scaled Nanosheet FETs with S/D Underlap Doping” was published by researchers at Global TCAD ...