With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.
Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.
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SciSparc initiate launch of 3D protein modeling initiative
SciSparc (SPRC)announced that the board of directors resolved to initiate the launch of an initiative to advance 3D protein modeling using quantum ...
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