JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated JESD220H and ...

While iOS features often leak ahead of their official launch, information about them rarely comes from hardware assembly ...

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples(1) of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being ...

EnOcean 5 Click, a new wireless connectivity Click board™ from MIKROE, the embedded solutions company cuts development time by providing hardware and ...

Bitcoin has long been known as the first cryptocurrency. People like it because it is simple, safe, and acts like digital gold. But in early 2023, something new emerged that opened up more ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

Generation WeldSaver 6 Passport with eVac Advanced Cap-Off Detection and Coolant Retraction MOUNTAIN VIEW, CA, UNITED STATES, ...

Aliro promises to fix the fragmentation of smart locks, where digital keys only work with specific apps or phones, and make them universal. Eventually, with widespread adoption of Aliro, a digital key ...

The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

We're relaunching PerfAgents with a renewed focus on performance test orchestration-bringing load testing, real user ...

The industry’s response is to split compute, memory, and I/O across dies, XPU chiplets are pushing toward the reticle limit, and stitch it all together with high‑bandwidth, energy‑efficient die‑to‑die ...

MIPI UniPro v3.0 and M-PHY v6.0 accelerate JEDEC UFS performance for edge AI in mobile, PC and automotive, and enable twice the previous data rate and gains in efficiency and scalability for flash ...