Abstract: Performance requirements and interconnect bottlenecks associated with technology scaling have led to the development of 3D stacked ICs (3D-SICs) based on through-silicon vias (TSVs). Testing ...
Abstract: Non-destructive 3D X-ray microscopy (XRM) has played an important role in advances of semiconductor packaging development and failure analysis [1]-[3]. Over the past decade, the IC industry ...
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