ISSCC addressed challenges for electronics to meet AI demand, AI to speed up the design and training the next generation ...

As digital data streams increase in speed and data rate, losses in PCB traces become ever more of a bottleneck.

Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa One smart verification software portfolio to accelerate creation, verification planning, ...

The technology is based on a vertically integrated design that bonds two chips into a single stack. By tightly coupling these silicon layers, Broadcom's engineers aim ...

Discover how Eastern Europe is playing a crucial role in semiconductor innovation and chip design, with strategic EU support ...

Fujitsu’s 144-core Monaka CPU will be built using 3D-chip stacking tech from Broadcom, the merchant silicon slinger revealed on Thursday. Fujitsu is an old hand at CPU design. Its Arm-based A64FX ...

A Broadcom executive told Reuters that it expects to sell at least 1 million chips by 2027 based on its stacked design tech. ...

Taiwan's IC design landscape is undergoing a massive structural shift. Early 2026 revenue data reveals a dual-track ...

Designing and deploying DSPs FPGAs aren’t the only programmable hardware option, or the only option challenged by AI. While AI makes it easier to design DSPs, there are rising complexities due to the ...

Fraunhofer IIS brings decades of expertise in system and algorithm design, e.g. for high-performance computing, low-power wireless communication, and advanced sensor technology applications. By ...

The early innings of the artificial intelligence (AI) infrastructure buildout have been dominated by training, as companies ...

Toronto-based AI chip startup Taalas says it can hardwire a large language model directly into silicon to accelerate inference beyond what conventional GPUs can deliver. Founded in 2023, its first ...