-Please note, all times are CDT - Monday, 28 July 8:30am – 9:30 AM - PES Members Meeting 9:30am – 11:00 AM - Opening Plenary Session - Transformation of the Electric Power Grid: Challenges, ...

(25:32 + Q&A) Dr. Anne Jourdain, imecFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid bonding is recognized as the key technology for advanced heterogeneous wafer-level system integration.

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A. Eroglu[1], S. Sivakumar[2], [1]Indiana University - Purdue University, Fort Wayne, United States, [2]MKS Instruments, Rochester, United States ...

I am currently enrolled as a PhD student in the University of Nottingham at the Horizon Centre for Doctoral Training where my research focuses on assessing guidelines and standards for age-appropriate ...

(18:56 + Q&A) Dr. M. Fernando Gonzalez-Zalba, Quantum Motion Technologies -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging (QC-DCEP) ... Summary: ...

Celebrate the Internet’s 50th anniversary! On 19 May 2024, 1,000 IEEE members and other internet enthusiasts from 56 countries participated in i50: A virtual celebration of 50 years of the internet.

Produced and edited by Stephen Esker, IEEE.tv Come along with Dr. Ted Rappaport as he explores the expo hall at the Brooklyn 6G Summit, 2023!

This year’s event theme, “6G—From Vision to Action,” casts light on a wide array of 6G topics, including the role of AI/ML, new mid-band spectrum and its ability to support new services, Integration ...

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The discussion in this talk includes the potential new challenges, new requirements, and new opportunities for the next generation of multiple access in these new scenarios. The next generation of ...

Hosted by Sreekant Narumanchi, join us for a chat with GQ Lu and Zichen Zhang where they discuss the paper: Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With ...